Analysis and Introduction of Camera Modules (1)

2020-04-10

As an image input device, the camera is widely used in camera shooting, mobile phone video, security monitoring and other fields, the quality of the camera has a great relationship with the camera module, with the continuous progress of science and technology, the process of the camera module is also constantly improving, today, I will take you to understand the camera module.

1. The composition of the module

Analysis and introduction of camera modules

FPC: FlexiblePrinted Circuit Flexible printed circuit board

PCB: PrintedCircuit Board printed circuit board

Sensor: Image sensor

IR: Infrared filter

Holder: Pedestal

Lens: Lens

Capacitance:电容

Glass:Plastic:Plastic

CCM:CMOS CameraModule

BGA: Ball GridArray Package球栅阵列封装。在印刷基板的背面按陈列方式制作出球形凸点用以代替引脚

CSP: Chip ScalePackage

COB: Chip onboard, chip onboard, chip handover and placement on printed circuit board. The electrical connection between the chip and the substrate is achieved by wire stitching

COG: Chip onglass

COF: Chip on FPC

CLCC: CeramicLeaded Chip Carrier带引脚的陶瓷芯片载体。引脚从封装的四个侧面引出，呈丁字形。

PLCC:PlasticLeaded Chip Carrier带引线的塑料芯片载体。引脚从封装的四个侧面引出，呈丁字形，是塑料制品。

2. Classification of modules

Categorized by connector and form factor

Analysis and introduction of camera modules

Press zoom capability

MF module: In addition to ordinary shooting scenes. Macro shooting is also supported.

FF module: the focusing range is about 50 cm ~ infinity.

AF module: can autofocus in scenes at different distances to clear height.