Considerations for heat dissipation design in camera module factories
2020-04-05
In recent years, with the rapid development of science and technology, due to the demand of the market, the performance of the camera sensor module camera module pixel is getting higher and higher, and the power consumption of the camera sensor is also getting higher and higher, so its heat dissipation has become a problem. The heat dissipation design of the camera module module has a certain impact on the effect of the camera. When the temperature is too high, there will be obvious noise in the dark, and some will even have color distortion such as the image turning red;
Recently, I encountered two customer feedback camera module temperature problems: one is usb200W+500W, because the structure is too small, designed as a 4-layer board, 2 sides of the arrangement of components, after half an hour of test aging, it is not conducive to heat dissipation. The preview image turns red, the working temperature reaches more than 80° (more than the stable working temperature of the camera), and the rebooted camera will return to normal after a few minutes of shutdown, and the other is the USB scan camera, which is powered on for more than 20 minutes when the temperature is high, and the preview interface has 4-5 obvious bright spots. These are the effects of a camera perm. How do we improve the cooling performance of the camera module? First, we need to analyze the heat source.
Heat source analysis
of camera modulePower consumption: High pixels and high frame rates inevitably increase the power consumption of the camera module. Under the same conditions, the higher the power consumption, the higher the module temperature. In addition, other heat sources for the working equipment can also affect the heating capacity of the module. The normal working temperature of the camera is -20°~70°, and the stable working stability is generally 0°~50°. If the temperature exceeds the normal operating temperature, we must find ways to improve it.
For the improvement of heat dissipation design, the following suggestions are summarized:
the pad design of the module itself is designed in the PCB/FPC wiring layer, the large area of copper foil is conducive to heat dissipation, the through-hole design increases the number of through holes to provide heat dissipation channels, and the heat dissipation area of exposed copper at the bottom of the module is increased.
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