Camera module technology
2020-03-03
At present, all kinds of electronic products, such as mobile phones, cameras, tablets and other portable electronic products, generally have the function of taking pictures and videos, and camera modules have been widely used in various electronic products. The thickness of current electronic products is getting thinner and thinner, the screen-to-body ratio is getting higher and higher, and the pixels are getting higher and higher, so it also puts forward smaller and thinner requirements for its camera modules.
The camera module comprises a line substrate 91, an imaging chip 93, a bracket 95, a filter 97 and a lens assembly 99. The imaging chip 93 and the scaffold 95 are arranged on the online substrate 91. The imaging chip 93 is located in the holding slot at the bottom of the holder 95. The filter 97 is arranged on the bracket 95 and is located between the lens assembly 99 and the imaging chip 93. The lens assembly 99 is mounted on the bracket 95. In the camera module, the line substrate 91 is fixed together by dispensing, curing, and the glue forms a large thickness, which can increase the overall height of the camera module, and the glue bonding strength is poor, and the problem that the line substrate falls off is easy to occur, resulting in defective products. The aim is to provide a smaller, more powerful manufacturing method for camera modules, electronic modules, and camera modules.
The camera module comprises a circuit board, an imaging chip, a bracket, a filter and a lens assembly, the imaging chip and the bracket are arranged on the circuit board, the imaging chip and the filter are located on the optical axis of the lens assembly, wherein the bracket comprises a plastic table and a metal frame of an integrated structure, and a part of the metal frame is exposed from the bottom of the plastic table and is connected with the circuit board by welding.
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